Tlhahlobo e Felletseng ea Mekhoa ea ho Tiisa, ho Shrinkage le ho Tšela Ts'ebetsong ea ho Lahla
▌Core Trifecta ea Ho Lahla Tšepe
Moleng oa tlhahiso ea li-engine block tsa BMW, baenjiniere ba ts'ebetso ba fumane hore ho laola mocheso o tšolohang ho 720±5℃ ho eketsa bolelele ba phallo ea alloy ea Al-Si ka 22% ha ka nako e ts'oanang ho fokotsa microporosity ho 0.15 vol%. Nyeoe ena e senola hore boleng ba ho lahla bo itšetleha ka taolo ea tšebelisano-'moho ea likarolo tse tharo tsa bohlokoa:
Taolo ea ho Tiisa ka Tsela e Latelang: Litekanyetso tsa CFD li bontša taolo ea mocheso oa hlobo e hatelitsoeng e ka eketsa karolelano ea lithollo tsa columnar ka har'a makhasi a motsoako oa nickel ho tloha ho 45% ho isa ho 78%, e leng se eketsang makhetlo a mararo bophelo ba mokhathala oa mocheso o phahameng.
Mekhoa ea ho Fepa e Bohlale: Theknoloji e ntseng e hlaha ea riser e thusoang ke motlakase e roba meeli ea ts'ebetso ea setso, ka Lisebelisoakhetla ea ntlo ea mabokose e fihlella tšebeliso ea tšepe ea 92%
Ho Tšela ha Hydrodynamic: Moralo oa gating oa Porsche o bōpehileng joaloka L o fokolitse ho kenyelletsoa ha oxide matlong a turbo ho tloha ho 15/cm² ho isa ho 3/cm²
▌Saense ea ho Tiea: Ho tloha ho Metallography ho ea ho Mafahla a Dijithale
"Paramethara" Tšepe e Putsoa "Aluminium" "Superalloy"
"Sekhahla sa ho Pholisa se Bohlokoa" 30℃/metsotso 80℃/metsotso 5℃/metsotso
"Sebaka sa Letsoho la Dendrite" 50-100μm 20-50μm 10-30μm
"Botebo ba Lisele tsa Eutectic" 200/mm² ″ 500/mm² ″ Kalafo e Ikhethang "
Leseli la Theknoloji:
○ Li-scan tsa micro-CT tsa fektheri ea Mercedes-Benz Stuttgart li lemoha ho fokotseha ha 0.05mm ka metsotsoana e 3
○ Algorithm ea GE ea multiphysics e bolela esale pele khatello ea ho lahla alloy ea Ti lihora tse 72 esale pele
▌Tsoelo-pele ea Litharollo tsa Phepo ea Liindasteri
Selemo | Katleho e Kholo | Phokotso e Phethahetseng ea Liphoso
1995 | Li-Riser tse Tloaelehileng | Motheo
2005 | Li-Riser tse nang le Insulation | 35%
2015 | Li-Riser tsa Exothermic | 58%
2023 | Phepelo e Bohlale ea Maikutlo | 82%
Thuto ea Nyeoe:
Bakeng sa lihlooho tsa disele tsa metsing:
○ Ke nkile sebaka sa lirise tse bulehileng tse ka holimo ka lirise tse shebaneng le lehlakore
○ Ho ekelitsoe lintlha tse 4 tsa ho phomola
○ Ho kenngwa tshebetsong ha ho tshelwa ka morao
→ Sekhahla sa diphoso se theohile ho tloha ho 18% ho ya ho 3%, e leng se bolokang ¥4200/yuniti
▌Mahlale a Sejoale-joale:
○ Velocimetry ea Laser Doppler: Tlhokomelo ea lebelo la sprue ea nako ea sebele (± 0.02m/s)
○ Lijana tse koahetsoeng ka nano: Phokotso ea 67% tahlehelong ea oxidation ea aluminium
○ Ho Tšela Mafahla a DijithaleSistimi ea Siemens e bolela esale pele hore e tla sebetsa hampe ka mokhoa o potlakileng
▌Moralo oa Theknoloji ea Lilemo tse Leshome
2025: Phepo e bohlale e etsoang ka tsela e fapaneng e rekisoang
2028: Ketsiso ea ho tiea ha matla ka thuso ea khomphutha ea quantum
2030: Ntlafatso ea ts'ebetso e ikemetseng ea AI
Lethathamo la Tlhahlobo ea Taolo ea Boleng:
✓ Tlhahlobo ea X-ray bakeng sa likotoana tse 5 tsa pele/sehlopha
✓ Theha di-curve tsa kamano ya mocheso le ho fokotseha
✓ 0.8% tumello ea ho fokotseha ha litekanyo tsa bohlokoa








